INDUSTRIAL ENGINEERING | |||||
Bachelor | TR-NQF-HE: Level 6 | QF-EHEA: First Cycle | EQF-LLL: Level 6 |
Course Code | Course Name | Semester | Theoretical | Practical | Credit | ECTS |
COP4403 | Inventron - Applied Electronics and PCB Design | Fall | 3 | 0 | 3 | 6 |
This catalog is for information purposes. Course status is determined by the relevant department at the beginning of semester. |
Language of instruction: | English |
Type of course: | Non-Departmental Elective |
Course Level: | Bachelor’s Degree (First Cycle) |
Mode of Delivery: | Face to face |
Course Coordinator : | Dr. Öğr. Üyesi ZAFER İŞCAN |
Recommended Optional Program Components: | High Speed Digital Design: Design of High Speed Interconnects and Signaling, Hanqiao Zhang, 2015, ISBN-13: 978-0124186637 |
Course Objectives: | The goal of this course to prepare students to enter the fast-paced world of electronics by applying the theoretical knowledge, learned in their foundation courses on analog and digital electronics, on a printed circuit board. Students will realise at least one printed circuit board project during the course. |
The students who have succeeded in this course; 1) Identifying the parameters of passive and active electronic components from technical datasheets 2) Schematic design of electronic circuits and simulation of the designed circuit 3) Designing pcb footprints of electronic components 4) Describing fundemantals of pcb design 5) Decribing multilayer (2-32) pcb design 6) Describing the fundementals of analog circuit design on pcb 7) Describing the fundementals of high speed digital circuit design on pcb 8) Explaning signal integrity and differential signal routing and crosstalk 9) Describing the fundementals of power circuit and RF circuit design on pcb 10) Explaning pcb manufacturing processes, gerber creation and IPC standards 11) Defining EMC guidelines for pcb layout |
Printed circuit board design, schematic design, defining footprint , parameters of electronic components, multilayer pcb design, analog pcb design, high speed digital pcb design, signal integrity, differential signal routing, power pcb layout RF pcb layout, EMC guidelines, IPC, gerber, pcb manufacturing, circuit simulation, performance and limitations of physical components, crosstalk, cross coupling |
Week | Subject | Related Preparation |
Course Notes / Textbooks: | High Speed Digital Design: Design of High Speed Interconnects and Signaling, Hanqiao Zhang, 2015, ISBN-13: 978-0124186637 |
References: |
Semester Requirements | Number of Activities | Level of Contribution |
Total | % | |
PERCENTAGE OF SEMESTER WORK | % 0 | |
PERCENTAGE OF FINAL WORK | % | |
Total | % |
No Effect | 1 Lowest | 2 Low | 3 Average | 4 High | 5 Highest |
Program Outcomes | Level of Contribution | |
1) | Build up a body of knowledge in mathematics, science and industrial engineering subjects; use theoretical and applied information in these areas to model and solve complex engineering problems. | |
2) | Identify, formulate, and solve complex engineering problems; select and apply proper analysis and modeling methods for this purpose. | |
3) | Design a complex system, process, device or product under realistic constraints and conditions, in such a way as to meet the desired result; apply modern design methods for this purpose. The ability to apply modern design methods to meet this objective. | |
4) | Devise, select, and use modern techniques and tools needed for solving complex problems in industrial engineering practice; employ information technologies effectively. | |
5) | Design and conduct experiments, collect data, analyze and interpret results for investigating the complex problems specific to industrial engineering. | |
6) | Cooperate efficiently in intra-disciplinary and multi-disciplinary teams; and show self-reliance when working independently. | |
7) | Demonstrate effective communication skills in both oral and written English and Turkish. Writing and understanding reports, preparing design and production reports, making effective presentations, giving and receiving clear and understandable instructions. | |
8) | Recognize the need for lifelong learning; show ability to access information, to follow developments in science and technology, and to continuously educate him/herself. | |
9) | Develop an awareness of professional and ethical responsibility, and behaving accordingly. Information about the standards used in engineering applications. | |
10) | Know business life practices such as project management, risk management, and change management; develop an awareness of entrepreneurship, innovation, and sustainable development. | |
11) | Know contemporary issues and the global and societal effects of modern age engineering practices on health, environment, and safety; recognize the legal consequences of engineering solutions. | |
12) | Develop effective and efficient managerial skills. |