ARTIFICIAL INTELLIGENCE ENGINEERING | |||||
Bachelor | TR-NQF-HE: Level 6 | QF-EHEA: First Cycle | EQF-LLL: Level 6 |
Course Code | Course Name | Semester | Theoretical | Practical | Credit | ECTS |
COP4403 | Inventron - Applied Electronics and PCB Design | Spring | 3 | 0 | 3 | 6 |
This catalog is for information purposes. Course status is determined by the relevant department at the beginning of semester. |
Language of instruction: | English |
Type of course: | Non-Departmental Elective |
Course Level: | Bachelor’s Degree (First Cycle) |
Mode of Delivery: | Face to face |
Course Coordinator : | Dr. Öğr. Üyesi ZAFER İŞCAN |
Recommended Optional Program Components: | High Speed Digital Design: Design of High Speed Interconnects and Signaling, Hanqiao Zhang, 2015, ISBN-13: 978-0124186637 |
Course Objectives: | The goal of this course to prepare students to enter the fast-paced world of electronics by applying the theoretical knowledge, learned in their foundation courses on analog and digital electronics, on a printed circuit board. Students will realise at least one printed circuit board project during the course. |
The students who have succeeded in this course; 1) Identifying the parameters of passive and active electronic components from technical datasheets 2) Schematic design of electronic circuits and simulation of the designed circuit 3) Designing pcb footprints of electronic components 4) Describing fundemantals of pcb design 5) Decribing multilayer (2-32) pcb design 6) Describing the fundementals of analog circuit design on pcb 7) Describing the fundementals of high speed digital circuit design on pcb 8) Explaning signal integrity and differential signal routing and crosstalk 9) Describing the fundementals of power circuit and RF circuit design on pcb 10) Explaning pcb manufacturing processes, gerber creation and IPC standards 11) Defining EMC guidelines for pcb layout |
Printed circuit board design, schematic design, defining footprint , parameters of electronic components, multilayer pcb design, analog pcb design, high speed digital pcb design, signal integrity, differential signal routing, power pcb layout RF pcb layout, EMC guidelines, IPC, gerber, pcb manufacturing, circuit simulation, performance and limitations of physical components, crosstalk, cross coupling |
Week | Subject | Related Preparation |
Course Notes / Textbooks: | High Speed Digital Design: Design of High Speed Interconnects and Signaling, Hanqiao Zhang, 2015, ISBN-13: 978-0124186637 |
References: |
Semester Requirements | Number of Activities | Level of Contribution |
Total | % | |
PERCENTAGE OF SEMESTER WORK | % 0 | |
PERCENTAGE OF FINAL WORK | % | |
Total | % |
No Effect | 1 Lowest | 2 Low | 3 Average | 4 High | 5 Highest |
Program Outcomes | Level of Contribution | |
1) | Have sufficient background in mathematics, science and artificial intelligence engineering. | |
2) | Use theoretical and applied knowledge in the fields of mathematics, science and artificial intelligence engineering together for engineering solutions. | |
3) | Identify, define, formulate and solve engineering problems, select and apply appropriate analytical methods and modeling techniques for this purpose. | |
4) | Analyse a system, system component or process and design it under realistic constraints to meet desired requirements; apply modern design methods in this direction. | |
5) | Select and use modern techniques and tools necessary for engineering applications. | |
6) | Design and conduct experiments, collect data, and analyse and interpret results. | |
7) | Work effectively both as an individual and as a multi-disciplinary team member. | |
8) | Access information via conducting literature research, using databases and other resources | |
9) | Follow the developments in science and technology and constantly update themself with an awareness of the necessity of lifelong learning. | |
10) | Use information and communication technologies together with computer software with at least the European Computer License Advanced Level required by their field. | |
11) | Communicate effectively, both verbal and written; know a foreign language at least at the European Language Portfolio B1 General Level. | |
12) | Have an awareness of the universal and social impacts of engineering solutions and applications; know about entrepreneurship and innovation; and have an awareness of the problems of the age. | |
13) | Have a sense of professional and ethical responsibility. | |
14) | Have an awareness of project management, workplace practices, employee health, environment and work safety; know the legal consequences of engineering practices. |