COMPUTER ENGINEERING | |||||
Bachelor | TR-NQF-HE: Level 6 | QF-EHEA: First Cycle | EQF-LLL: Level 6 |
Course Code | Course Name | Semester | Theoretical | Practical | Credit | ECTS |
COP4403 | Inventron - Applied Electronics and PCB Design | Spring | 3 | 0 | 3 | 6 |
This catalog is for information purposes. Course status is determined by the relevant department at the beginning of semester. |
Language of instruction: | English |
Type of course: | Non-Departmental Elective |
Course Level: | Bachelor’s Degree (First Cycle) |
Mode of Delivery: | Face to face |
Course Coordinator : | Dr. Öğr. Üyesi ZAFER İŞCAN |
Recommended Optional Program Components: | High Speed Digital Design: Design of High Speed Interconnects and Signaling, Hanqiao Zhang, 2015, ISBN-13: 978-0124186637 |
Course Objectives: | The goal of this course to prepare students to enter the fast-paced world of electronics by applying the theoretical knowledge, learned in their foundation courses on analog and digital electronics, on a printed circuit board. Students will realise at least one printed circuit board project during the course. |
The students who have succeeded in this course; 1) Identifying the parameters of passive and active electronic components from technical datasheets 2) Schematic design of electronic circuits and simulation of the designed circuit 3) Designing pcb footprints of electronic components 4) Describing fundemantals of pcb design 5) Decribing multilayer (2-32) pcb design 6) Describing the fundementals of analog circuit design on pcb 7) Describing the fundementals of high speed digital circuit design on pcb 8) Explaning signal integrity and differential signal routing and crosstalk 9) Describing the fundementals of power circuit and RF circuit design on pcb 10) Explaning pcb manufacturing processes, gerber creation and IPC standards 11) Defining EMC guidelines for pcb layout |
Printed circuit board design, schematic design, defining footprint , parameters of electronic components, multilayer pcb design, analog pcb design, high speed digital pcb design, signal integrity, differential signal routing, power pcb layout RF pcb layout, EMC guidelines, IPC, gerber, pcb manufacturing, circuit simulation, performance and limitations of physical components, crosstalk, cross coupling |
Week | Subject | Related Preparation |
Course Notes / Textbooks: | High Speed Digital Design: Design of High Speed Interconnects and Signaling, Hanqiao Zhang, 2015, ISBN-13: 978-0124186637 |
References: |
Semester Requirements | Number of Activities | Level of Contribution |
Total | % | |
PERCENTAGE OF SEMESTER WORK | % 0 | |
PERCENTAGE OF FINAL WORK | % | |
Total | % |
No Effect | 1 Lowest | 2 Low | 3 Average | 4 High | 5 Highest |
Program Outcomes | Level of Contribution | |
1) | Adequate knowledge in mathematics, science and computer engineering; the ability to use theoretical and practical knowledge in these areas in complex engineering problems. | |
2) | Ability to identify, formulate, and solve complex engineering problems; ability to select and apply appropriate analysis and modeling methods for this purpose. | 2 |
3) | Ability to design a complex system, process, device or product to meet specific requirements under realistic constraints and conditions; ability to apply modern design methods for this purpose. | 3 |
4) | Ability to develop, select and use modern techniques and tools necessary for the analysis and solution of complex problems encountered in computer engineering applications; ability to use information technologies effectively. | |
5) | Ability to design, conduct experiments, collect data, analyze and interpret results for the study of complex engineering problems or computer engineering research topics. | 3 |
6) | Ability to work effectively within and multi-disciplinary teams; individual study skills. | 2 |
7) | Ability to communicate effectively in verbal and written Turkish; knowledge of at least one foreign language; ability to write active reports and understand written reports, to prepare design and production reports, to make effective presentations, to give and receive clear and understandable instructions. | |
8) | Awareness of the necessity of lifelong learning; ability to access information, to follow developments in science and technology and to renew continuously. | |
9) | To act in accordance with ethical principles, professional and ethical responsibility; information on the standards used in engineering applications. | |
10) | Information on business practices such as project management, risk management and change management; awareness of entrepreneurship and innovation; information about sustainable development. | |
11) | Knowledge of the effects of engineering practices on health, environment and safety in the universal and social scale and the problems of the era reflected in engineering; awareness of the legal consequences of engineering solutions. |