AMERICAN CULTURE AND LITERATURE | |||||
Bachelor | TR-NQF-HE: Level 6 | QF-EHEA: First Cycle | EQF-LLL: Level 6 |
Course Code | Course Name | Semester | Theoretical | Practical | Credit | ECTS |
COP4403 | Inventron - Applied Electronics and PCB Design | Spring | 3 | 0 | 3 | 6 |
This catalog is for information purposes. Course status is determined by the relevant department at the beginning of semester. |
Language of instruction: | English |
Type of course: | Non-Departmental Elective |
Course Level: | Bachelor’s Degree (First Cycle) |
Mode of Delivery: | Face to face |
Course Coordinator : | Dr. Öğr. Üyesi ZAFER İŞCAN |
Recommended Optional Program Components: | High Speed Digital Design: Design of High Speed Interconnects and Signaling, Hanqiao Zhang, 2015, ISBN-13: 978-0124186637 |
Course Objectives: | The goal of this course to prepare students to enter the fast-paced world of electronics by applying the theoretical knowledge, learned in their foundation courses on analog and digital electronics, on a printed circuit board. Students will realise at least one printed circuit board project during the course. |
The students who have succeeded in this course; 1) Identifying the parameters of passive and active electronic components from technical datasheets 2) Schematic design of electronic circuits and simulation of the designed circuit 3) Designing pcb footprints of electronic components 4) Describing fundemantals of pcb design 5) Decribing multilayer (2-32) pcb design 6) Describing the fundementals of analog circuit design on pcb 7) Describing the fundementals of high speed digital circuit design on pcb 8) Explaning signal integrity and differential signal routing and crosstalk 9) Describing the fundementals of power circuit and RF circuit design on pcb 10) Explaning pcb manufacturing processes, gerber creation and IPC standards 11) Defining EMC guidelines for pcb layout |
Printed circuit board design, schematic design, defining footprint , parameters of electronic components, multilayer pcb design, analog pcb design, high speed digital pcb design, signal integrity, differential signal routing, power pcb layout RF pcb layout, EMC guidelines, IPC, gerber, pcb manufacturing, circuit simulation, performance and limitations of physical components, crosstalk, cross coupling |
Week | Subject | Related Preparation |
Course Notes / Textbooks: | High Speed Digital Design: Design of High Speed Interconnects and Signaling, Hanqiao Zhang, 2015, ISBN-13: 978-0124186637 |
References: |
Semester Requirements | Number of Activities | Level of Contribution |
Total | % | |
PERCENTAGE OF SEMESTER WORK | % 0 | |
PERCENTAGE OF FINAL WORK | % | |
Total | % |
No Effect | 1 Lowest | 2 Low | 3 Average | 4 High | 5 Highest |
Program Outcomes | Level of Contribution | |
1) | Upon graduation, students will acquire key skills and attributes to conduct research to use research tools, to solve problems, to communicate effectively and to transfer skills to the workplace. | |
2) | Upon graduation, students will have developed the ability to discuss key issues in fluent English. | |
3) | Upon graduation, students will have developed the ability to compose written documents in English with a mature prose style. | 4 |
4) | Upon graduation, students will have gained broad knowledge of the American and English literary canons. | 4 |
5) | Upon graduation, students will have developed the ability to analyze, synthesize and criticize sophisticated works of American and English literature. | 4 |
6) | Upon graduation, students will have achieved in depth the understanding of contemporary American culture. | 3 |
7) | Upon graduation, students will have developed the ability to draw links among diverse literary texts and documents and establish critical connections and adopt an interdisciplinary attitude. | 3 |
8) | Upon graduation, students will be able to develop new projects individually or in teams. | 3 |
9) | Upon graduation, students will be able to apply their knowledge into their lives for interdisciplinary problem-solving and solutions. | 4 |